Probe apparatus manufacturing method thereof and substrate inspecting method using the same

ABSTRACT

In a probe apparatus comprising an inspecting device, an intermediate substrate and a probe substrate, in which the inspecting device is electrically connected to a proximal end of the intermediate substrate, and the intermediate substrate has a distal end electrically connected to a proximal end of the probe substrate, and the probe substrate has a distal end electrically connectable to a substrate under inspection, a plurality of probe substrates are electrically connected to the single intermediate substrate. When a particular probe substrate  4  is damaged, only the particular probe substrate  4  may be changed, the other probe substrates  4  continuing to be used, thereby achieving economy.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application is a 371 of PCT/JP00/08024, filed Nov. 13, 2000.

TECHNICAL FIELD

The present invention relates to a probe apparatus for use in inspectingliquid crystal panels and the like, a manufacturing method thereof, anda substrate inspecting method using this apparatus.

BACKGROUND ART

As is well known, various types of probe apparatus are widely used ininspecting liquid crystal panels and the like (hereinafter referred toas substrates under inspection).

One example of conventional apparatus will be described with referenceto FIGS. 9 and 10. FIG. 9 is a front view of such a conventional probeapparatus in an inspecting situation, and FIG. 10 is a plan viewthereof.

This probe apparatus comprises an inspecting device 10, an intermediatesubstrate 3 and a probe substrate 4. The inspecting device 10 iselectrically connected to a proximal end e1 of the intermediatesubstrate 3. The intermediate substrate 3 has a distal end e2electrically connected to a proximal end b1 of the probe substrate 4.The probe substrate 4 has a distal end b2 electrically connectable to asubstrate 11 under inspection. The inspecting device 10 includes TAB(Tape Automate bonding) packages 2, a control substrate 1, and a signalgenerator 9. The signal generator 9 is electrically connected to thecontrol substrate 1 through a signal transmission line 12. The controlsubstrate 1 is electrically connected to proximal ends c2 of the TABpackages 2. The TAB packages 2 have distal ends c1 electricallyconnected to the proximal end e1 of the intermediate substrate 3.

Each of the control substrate 1, intermediate substrate 3 and probesubstrate 4 has an elongated rectangular shape. A plurality of TABpackages 2 are arranged at predetermined intervals between the controlsubstrate 1 and the intermediate substrate 3.

The probe substrate 4 has a plurality of inspecting terminals 4 ajuxtaposed at micro intervals, e.g. of 50 μm. The inspecting terminals 4a have distal ends thereof precisely positioned relative to a pluralityof pads formed on the substrate 11 under inspection. The inspectingterminals and pads are placed in pressure contact to be conductive witheach other, thereby allowing a predetermined inspection to be carriedout.

However, each inspecting terminal 4 a has a minute width, e.g. of 20 μm,and thus is prone to damage when the probe substrate 4 is pressed by apressure head to place the inspecting terminals 4 a in pressure contactwith the pads of the substrate 11 under inspection. In addition, it isnecessary to replace the entire probe substrate 4 with a new substrate,due to its elongated one-piece formation, even when one of theinspecting terminals 4 a becomes defective because of disconnection orthe like. Such a replacement is costly while amounting to a poor yield,which results in an economic disadvantage.

Generally, the above probe apparatus has “the probe substrate 4 and theintermediate substrate 3” and “the intermediate substrate 3 and the TABpackages 2” joined, through an ACF (Anisotropic Conductive Film),respectively, and “the TAB packages 2 and the control substrate 1”joined by solder. Thus, the probe substrate 4 formed of polymer resinfilm is easily deformable under the influences of heat, stress and thelike. As a result, the more the probe substrate is elongated, the moreoften the intervals become irregular between the inspecting terminals 4a, which impedes improvement in the accuracy of terminal patterns. Evenif the probe apparatus may be manufactured with high precision, somedisadvantages remain in that the intervals between the inspectingterminals 4 a are likely to become irregular due to subsequent changesin environmental conditions, and that the probe substrate 4 has arelatively short life (i.e. a period over which a high precisioncondition can be maintained).

Further, due to the above-described disadvantages, it is difficult tomaintain a precise registration between the numeral inspecting terminals4 a and the pads of the substrate 11 under inspection in a constantstate during an inspection. This hampers a stable inspection.

The present invention has been made having regard to the drawbacks notedabove, and its primary object is to provide a probe apparatus forenabling an economic replacement by a new probe substrate in the eventof a defect such as a disconnection.

A second object of the invention is to provide a durable probe apparatuswhich is manufactured with a reduced irregularity in the intervals ofinspecting terminals of a probe substrate to enhance the accuracy ofterminal patterns, and which maintains such accuracy over a long periodafter its manufacture.

A third object of the invention is to provide a method of effecting astable inspection using such a probe apparatus.

DISCLOSURE OF THE INVENTION

In order to fulfill the above primary object, the present inventionprovides a probe apparatus comprising an inspecting device, anintermediate substrate and a probe substrate, said inspecting devicebeing electrically connected to a proximal end of said intermediatesubstrate, said intermediate substrate having a distal end electricallyconnected to a proximal end of said probe substrate, said probesubstrate having a distal end electrically connectable to a substrateunder inspection, characterized in that a plurality of probe substratesare juxtaposed for a single intermediate substrate.

That is, according to the present invention, when a particular probesubstrate is damaged, only the particular probe substrate may bechanged, the other probe substrates continuing to be used, therebyachieving economy.

In the probe apparatus according to the present invention, saidinspecting device includes, for example, a control substrateelectrically connected to a signal generator, and a plurality of TAB(Tape Automated bonding) packages, said plurality of TAB packages eachhaving a proximal end electrically connected to said control substrateand a distal end electrically connected to the proximal end of saidintermediate substrate. It is not absolutely necessary for the controlsubstrate to be directly connected to the plurality of TAB packages. Itmay be electrically connected through a plurality of connectingsubstrates.

In place of the plurality of TAB packages, a plurality of drivingintegrated circuit elements may be mounted on the intermediatesubstrate, distal ends of the driving integrated circuit elements beingelectrically connected to the proximal ends of the plurality of probesubstrates. In this case as well, it is not absolutely necessary todirectly interconnect the control substrate and each driving integratedcircuit element, but they may be electrically interconnected through aplurality of connecting substrates.

Preferably, the above plurality of connecting substrates comprise FPCs(Flexible Printed Circuit) and are bent for connection. Thisconstruction facilitates replacement of the TAB packages and drivingintegrated circuit elements.

In the present invention, it is preferred that said intermediatesubstrate is formed of an inorganic material. Since an inorganicmaterial is not readily deformed under the influence of heating in timeof joining or by changes in environmental conditions, which may enhancethe accuracy for connecting the intermediate substrate to the probesubstrates. As the inorganic material, a ceramic material isparticularly desirable. Further, the intermediate substrate, preferably,has a coefficient of hygroscopic expansion not exceeding 1 ppm/% RH inorder to avoid the influence of its dimensional variations caused bymoisture absorption.

In the present invention, it is preferred that said intermediatesubstrate is at least 2.5 times as thick as said probe substrate. Withthis construction, the intermediate substrate may have a rigiditygreater than that of the probe substrate, as a result of whichdeformation of the probe substrate may be restrained.

In the present invention, said probe substrate comprises an FPC(Flexible Printed Circuit), for example. Preferably, the probe substratehas a coefficient of hygroscopic expansion not exceeding 10 ppm/% RH inorder to reduce the unevenness in the intervals between the inspectingterminals of the probe substrate and to maintain the accuracy of theinspecting terminals over a long period.

In the present invention, said probe substrate includes, for example, aplurality of inspecting terminals arranged thereon, proximal ends ofthese inspecting terminals being connected to distal ends of a pluralityof electrodes arranged on said intermediate substrate, distal ends ofsaid inspecting terminals being connectable to a plurality of padsarranged on said substrate under inspection. In this probe apparatus,said inspecting terminals of said probe substrates, preferably, have awidth smaller than a width of said pads and a space between said pads ofsaid substrate under inspection. This construction provides an increasedtolerance for the accuracy of positioning of inspecting terminalsrelative to the pads of the substrate under inspection, which preventsshort circuits occurring between the adjacent pads.

In order to prevent the distal ends of the inspecting terminals frombeing separated from the probe substrate, it is preferable that thedistal ends of the inspecting terminals of the probe substrates arepositioned inwardly of an edge at the distal end of the probe substrate.

Further, a method of manufacturing the probe apparatus according to thepresent invention is characterized in that said probe substrates, withintervals p3 for forming the inspecting terminals at the distal ends ofsaid probe substrates to be connected to the pads of said substrateunder inspection being larger than intervals for forming said pads, andintervals p4 for forming the inspecting terminals at the proximal endsof said probe substrates to be connected to said electrodes of theintermediate substrate being smaller than intervals for forming saidelectrodes of said intermediate substrate, are joined to saidintermediate substrate by thermo compression bonding, using one of ACF(Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF(Non-conductive Film) and NCP (Non-conductive Paste). According to thismanufacturing method, the intervals p4 for forming the inspectingterminals at the proximal ends of the probe substrates to be connectedto the electrodes of the intermediate substrate are smaller than theintervals p2 for forming the electrodes of the intermediate substrate.When the probe substrates having a larger coefficient of thermalexpansion than the intermediate substrate is joined to the intermediatesubstrate, the proximal ends of the probe substrates are thermallyexpanded to a relatively large extend. Consequently, the intervals ofthe electrodes of the intermediate substrate become substantially equalto the intervals of the inspecting terminals of the probe substrate.This enhances the yield of joining. As the probe substrates arethermally expanded at the distal ends thereof, they are contracted atthe proximal ends thereof. According to the manufacturing method of thepresent invention, since the intervals p3 for forming the inspectingterminals at the distal ends of the probe substrates to be connected tothe pads of the substrate under inspection are larger than the intervalsp1 for forming the pads, the probe substrates are contracted at thedistal ends thereof, thereby to make the intervals of the terminals atthe distal ends of the probe substrates substantially equal to theintervals of the pads of the substrate under inspection.

A method of inspecting a substrate by using a probe apparatus accordingto the present invention is characterized in that a difference incoefficient of thermal expansion between said intermediate substrate andsaid substrate under inspection is 5 ppm/° C. or less. According to thissubstrate inspecting method, since the difference in coefficient ofthermal expansion between the intermediate substrate and the substrateunder inspection is slight, the intervals for forming the inspectingterminals on the probe substrate connected to the intermediate substratebecome substantially equal to the intervals for forming the pads on thesubstrate under inspection, to enable a stable inspection.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing one example of probe apparatus accordingto the present invention.

FIG. 2 shows a relationship between pads of a substrate underinspection, inspecting terminals of a probe substrate, and electrodes ofan intermediate substrate, in which: (A) is a plan view of the pads ofthe substrate under inspection, (B) is a plan view of the inspectingterminals of the probe substrate, and (C) is a plan view of theelectrodes of the intermediate substrate.

FIG. 3 is a plan view showing another example of probe apparatusaccording to the present invention.

FIG. 4 is a plan view showing a further example of probe apparatusaccording to the present invention.

FIG. 5 is a front view showing a further example of probe apparatusaccording to the present invention.

FIG. 6 is a plan view showing a further example of probe apparatusaccording to the present invention.

FIG. 7 is a plan view showing an example including a plurality of TABpackages for a single probe substrate.

FIG. 8 is a plan view showing an example in which the TAB packages areshifted either to the right or left relative to the probe substrate.

FIG. 9 is a front view of a conventional probe apparatus in aninspecting situation.

FIG. 10 is a plan view of the apparatus shown in FIG. 9.

BEST MODE FOR CARRYING OUT THE INVENTION

Preferred embodiments of the present invention will be describedhereinafter with reference to the drawings.

FIG. 1 is a plan view of a probe apparatus in one embodiment of thepresent invention. A side view of the probe apparatus in this embodimentis similar to FIG. 9.

As shown, the probe apparatus comprises an inspecting device 10, oneintermediate substrate 3, and a plurality of probe substrates 4. Theintermediate substrate 3 has an elongated rectangular shape (e.g. atleast 200 mm), and the inspecting device 10 is electrically connected toa proximal end e1 of the intermediate substrate 3. The plurality ofprobe substrates 4, each having a short rectangular shape (e.g. in theorder of 20 mm), are juxtaposed at predetermined intervals along an edgeat a distal end e2 of the intermediate substrate 3. Each probe substrate4 has a proximal end b1 electrically connected to the distal end e2 ofthe single intermediate substrate 3. A distal end b2 of each probesubstrate 4 is electrically connectable to a substrate 11 underinspection (cf. FIG. 9) through pressure contact.

The inspecting device 10 includes a plurality of TAB (Tape Automatedbonding) packages 2, a control substrate 1 having an elongatedrectangular shape (e.g. at least 200 mm), and a signal generator 9. TheTAB packages 2 are packages for sealing integrated circuit elements,which have a heat-resistant film such as of polyimide resin laminatedwith a metal film such as copper foil, and etched to define wiringpatterns. In this embodiment, driving integrated circuit elements aresealed in each TAB package 2 for lighting and driving the substrate 11under inspection, e.g. a liquid crystal panel. Each TAB package 2 hasgroups of electrodes arranged at a proximal end c2 thereof (adjacent thecontrol substrate 1) and at a distal end c1 (adjacent the intermediatesubstrate 3), respectively. The proximal end c2 of each TAB package 2 iselectrically connected to the control substrate 1, and the distal end c1of each TAB package 2 to the proximal end e1 of the intermediatesubstrate 3. The signal generator 9 is also electrically connected tothe control substrate 1.

To be “electrically connected” as used herein means to be a conductivestate. For example, distal ends of a plurality of electrodes 3 a formedon the intermediate substrate 3 are joined to proximal ends of aplurality of inspecting terminals 4 a formed on the probe substrates 4to be in the conductive state. Similarly, proximal ends of the pluralityof electrodes 3 a formed on the intermediate substrate 3 are joined todistal ends of the plurality of electrodes formed on each TAB package 2to be in the conductive state. Also, proximal ends of the plurality ofelectrodes formed on each TAB package 2 are joined to a plurality ofelectrodes formed on the control substrate 1 to be in the conductivestate.

The TAB packages 2 and the control substrate 1 are soldered to eachother to be in the conductive state. However, a different joining methodsuch as ACF or compression bonding may be employed. The controlsubstrate 1 and the signal generator 9 are in a conductive state asignal transmission line 12. The probe substrates 4 and the intermediatesubstrate 3 are joined together through ACF (Anisotropic ConductiveFilm) to be in a conductive state. In a similar way, the intermediatesubstrate 3 and the TAB packages 2 are joined through ACF to be in aconductive state. The ACF is a connecting material having threefunctions of adhesion, conduction and insulation at the same time, andcomprising an electrically anisotropic polymer film having, when thermocompression bonded, electrical anisotropy with conductivity in thedirection of film thickness and insulating property in a direction ofplane. This film is formed by mixing conductive particles into apolymeric material having adhesive and insulating properties.

Each probe substrate 4 is an FPC (Flexible Printed Circuit) comprisingan insulating substrate made of an organic material such as lowhygroscopicity glass epoxy, liquid crystal polymer, polyimide,polyphenylene oxide, polyphenylene ethyl ether or the like, andconductive electrodes formed of copper, nickel, gold or the like on theinsulating substrate. Although the probe substrate having a coefficientof hygroscopic expansion not exceeding 10 ppm/% RH is used here, it ispreferable to use one having a coefficient of hygroscopic expansion notexceeding 5 ppm/% RH.

Where the probe substrates 4 comprise glass epoxy substrates, theelectrode conduction tends to become uneven in time of pressureconnection and cracks tend to occur when pressure is repeatedly applied.These disadvantages may be overcome by employing a heat-resistant filmsuch as polyimide film.

The intermediate substrate 3 comprises an insulating substrate made ofan inorganic material such as glass, alumina, aluminum nitride, siliconcarbide, mullite or other ceramic material, or a metallic materialhaving a low coefficient of thermal expansion and coated with ceramic,and conductive electrodes formed of ITO (Indium Tin Oxide), aluminum,chrome or the like on the insulating substrate. The intermediatesubstrate having a coefficient of hygroscopic expansion not exceeding 1ppm/% RH is used. The difference in the coefficient of thermal expansionbetween the intermediate substrate 3 and the substrate under inspectionis set to 5 ppm/° C. or less.

In this probe apparatus, as described above, the coefficients ofhygroscopic expansion of the probe substrates 4 and intermediatesubstrate 3 are set within the above ranges, which enable the electrodes3 a of the intermediate substrate 3 to join the inspecting terminals 4 aof the probe substrates 4 with high accuracy.

More particularly, where each probe substrate 4 with a total length of30 mm has a coefficient of hygroscopic expansion at 10 ppm/% RH, thetotal length of the substrate is increased or decreased by 12 μm with ahumidity increase or decrease by 40%. Since the intervals between theinspecting terminals 4 a are typically 50 μm, it is preferable to setthe coefficient of hygroscopic expansion of the probe substrates 4 to 10ppm/% RH or less.

Where the difference in the coefficient of thermal expansion (commonlyreferred to as CTE) between the intermediate substrate 3 and thesubstrate 11 under inspection is 5 ppm/° C., the total length 300 mm ofthe intermediate substrate 3 increases by 15 μm with a temperatureincreases of 10° C. In view of this also, it is preferable to set thedifference in the coefficient of thermal expansion between theintermediate substrate 3 and the substrate 11 under inspection to 5ppm/° C. or less.

In order that dimensional variations of the probe substrates 4 may notaffect deformation of the intermediate substrate 3, the intermediatesubstrate 3 preferably is at least 2.5 times as thick as the probesubstrates 4. The inspecting terminals 4 a of the probe substrates 4 andthe electrodes 3 a of the intermediate substrate 3 are formed inpredetermined patterns by a semi-additive method and a subtract method,respectively, but may be formed by other methods.

FIG. 2(A) shows conductive pads 11 a formed on the substrate 11 underinspection, FIG. 2(B) shows the inspecting terminals 4 a formed on eachprobe substrate 4, and FIG. 2(C) shows the electrodes 3 a formed on theintermediate substrate 3. The plurality of inspecting terminals 4 aformed on each probe substrate 4 to be connected to the plurality ofpads 11 a formed on the substrate 11 under inspection have a width w2smaller than a width w1 of each pad 11 a and a space s1 between the pads11 a.

As a result, an increased tolerance of accuracy is allowed forpositioning the group of inspecting terminals 4 a relative to the groupof pads 11 a when the distal ends b2 of the probe substrates 4 areconnected to the substrate 11 under inspection. This effectivelyprevents short circuits occurring between adjacent pads 11 a.

With this probe apparatus, the group of inspecting terminals 4 a at thedistal ends of the probe substrates 4 to be connected to the group ofpads 11 a of the substrate 11 under inspection are arranged at intervalsp3 larger than intervals p1 between the pads 11 a. The inspectingterminals 4 a at the proximal end of the probe substrate 4 connected tothe group of electrodes 3 a of the intermediate substrate 3 are arrangedat intervals p4 smaller than intervals p2 between the electrodes 3 a ofthe intermediate substrate 3. Such probe substrates 4 are manufacturedby attaching ACF to the intermediate substrate 3 by thermo compressionbonding.

As a result, it is possible to cope with interval variations caused by athermal extension occurring at the proximal ends of the probe substrates4 and by a contraction occurring at the distal ends of the probesubstrates 4 when the probe substrate 4 and the intermediate substrate 3are electrically connected together. Thus, the probe apparatus isprovided with constant accuracy (with reduced variations in accuracy).

The group of inspecting terminals 4 a of each probe substrate 4 isarranged such that each inspecting terminal 4 a has a distal endpositioned inwardly of the edge at the distal end of the probe substrate4 by s2 (e.g. 0.1-0.2 mm). This prevents the inspecting terminals 4 afrom being separated at the distal ends when the probe substrate 4 isconnected to the substrate 11 under inspection.

Instead of the ACF used for connecting the probe substrates 4 to theintermediate substrate 3, any one of ACP (Anisotropic Conductive Paste),NCF (Non-conductive Film) and NCP (Non-conductive Paste) may be used. Asis ACF, ACP is a connecting material in paste form having the threefunctions of adhesion, conduction and insulation at the same time. NCFand NCP are a film-type connecting material or paste-type connectingmaterial having an isolating function.

With this probe apparatus, it is possible to electrically connect, bypressure contact, the inspecting terminals 4 a of the probe substrates 4to the pads 11 a of the substrate 11 under inspection (e.g. a liquidcrystal panel), to carry out a required inspection. At that time, thesignal generator 9 produces lighting pattern signals.

The control substrate 1 includes a circuit for converting levels of thesignals. Since, generally, the signal generator 9 is remote from thecontrol substrate 1, the signals are transmitted therebetween with anoise countermeasure. The control substrate 1 converts a signal receivedfrom the signal generator 9 to an LVDS (Low Voltage Differential Signal)for application to the TAB packages 2.

The TAB packages 2 receive a lighting pattern signal and generate avoltage for driving the substrate 11 under inspection. Thus, a visualinspection is effected where the substrate 11 under inspection is aliquid crystal panel or the like.

As described above, the probe apparatus according to the presentinvention includes the plurality of probe substrates 4 arranged atpredetermined intervals for the single elongated intermediate substrate3. As a result, when one of the probe substrates 4 becomes defective dueto a disconnection or the like, only the particular defective substrate4 may be changed. In this way, the probe substrates 4 may be changedeconomically.

The intermediate substrate 3 is formed of an inorganic material that isnot easily subjected to the influence of humidity during a manufacturingprocess. The intermediate substrate 3 has a coefficient of hygroscopicexpansion not exceeding 1 ppm/% RH. The probe substrates 4 are connectedto such intermediate substrate 3. This effectively reduces theinstability of manufacturing accuracy caused by the influence ofhumidity when the probe apparatus is manufactured. As a result, intervalvariations of the inspecting terminals 4 a can be reduced to enhance theaccuracy of terminal patterns.

The apparatus also employs the probe substrate 4 having a coefficient ofhygroscopic expansion not exceeding 10 ppm/% RH. Thus, it is possible tofurther reduce the instability of manufacturing accuracy caused by theinfluence of humidity, to further enhance the accuracy of terminalpatterns, and to maintain the accuracy over a long period aftermanufacture.

Since the width w2 of each of the inspecting terminals 4 a formed on theprobe substrates 4 to be connected to the group of pads 11 a formed onthe substrate 11 under inspection is smaller than the width w1 of eachpad 11 a and the space s1 between the pads 11 a, an increased toleranceof accuracy is allowed for positioning the group of inspecting terminals4 a relative to the group of pads 11 a, thereby preventing shortcircuits occurring between adjacent pads 11 a.

Since the difference in the coefficient of thermal expansion between theintermediate substrate 3 and the substrate 11 under inspection is set to5 ppm/° C. or less, it is possible to carry out a stable inspection.Moreover, since the intermediate substrate 3 is at least 2.5 times asthick as the probe substrates 4, it is possible to carry out aninspection with increased stability.

While the probe apparatus in according to the present invention has beendescribed in relation to one embodiment, the present invention mayimplemented in other forms, such as those shown in FIGS. 3 through 5.

The above probe apparatus shown in FIG. 1 includes a single intermediatesubstrate 3. FIG. 3 shows a probe apparatus including a plurality ofintermediate substrates 3. These intermediate substrates 3 are bonded toa single elongated rectangular reinforcing plate 5 formed of the samematerial as the intermediate substrates 3. As illustrated, a pluralityof (six in this embodiment) TAB packages 2 are electrically connected toeach intermediate substrate 3.

A probe apparatus shown in FIG. 4 is different from the foregoingembodiments in that a plurality of control substrates 1 are provided. Inthis embodiment also, a plurality of (four in this embodiment) TABpackages 2 are electrically connected to each control substrate 1.

In FIG. 5, the control substrate 1 is not directly connected to each TABpackage 2 as in the foregoing embodiments (embodiments of FIGS. 1, 3 and4). Instead, they are electrically interconnected indirectly through aconnecting substrate 6. The connecting substrate 6 is in the form of anFPC (Flexible Printed Circuit). The connecting substrate 6 is joined tothe control substrate 1 in a bend and press mode as shown. Theconnecting substrate 6 has a sufficient length so that the TAB packagesmay be changed easily.

Further, a probe apparatus shown in FIG. 6 includes driving integratedcircuit elements 7 mounted on the intermediate substrate 3, asreplacements for the TAB packages 2. The probe substrates 4 and theconnecting substrates 6 are electrically connected to the drivingintegrated circuit elements 7.

More particularly, a plurality of driving integrated circuit elements 7are mounted and arranged at predetermined regular intervals on theintermediate substrate 3 as illustrated. Each driving integrated circuitelement 7 has electrodes 7 a provided at a distal end thereof andelectrically connected to a proximal end of the probe substrate 4.Electrodes 7 a provided at a proximal end thereof are electricallyconnected to the control substrate 1 through the connecting substrate 6.

Each driving integrated circuit element 7 comprises a liquid crystaldriving IC for switching each pixel on and off and selecting a level ofbrightness of the liquid crystal. On the other hand, each of the aboveTAB packages comprises a TAB tape defining a circuit and having adriving IC mounted thereon.

The above type (the type shown in FIG. 6) including the drivingintegrated circuit elements 7 directly mounted on the intermediatesubstrate 3 may dispense with a process of connecting the circuitelements to the TAB tape, and thus has the advantage of realizing lowcost and coping with fine-defined patterns.

The intervals for bonding the TAB packages 2, probe substrates 4,connecting substrate 6 and driving integrated circuit elements 7 may beeither constant or random, and predetermined intervals are selected asoccasion demands.

Referring to FIG. 7, a plurality of (two in this embodiment) TABpackages 2 may be connected to a single probe substrate 4.Alternatively, as shown in FIG. 8, the TAB packages 2 may be shiftedeither to the right or left relative to the probe substrates 4.

INDUSTRIAL UTILITY

As described hereinbefore, the probe apparatus, manufacturing methodthereof, and substrate inspecting method using the same according to thepresent invention enable the probe substrate to be changed economicallyand enhance the accuracy of the inspecting terminals of the probesubstrate, and are thus well suited for inspecting substrates such asliquid crystal panels.

1. A probe apparatus comprising an inspecting device, an intermediatesubstrate and at least one probe substrate, said inspecting deviceincluding a signal generator, a plurality of TAB (Tape AutomatedBonding) packages and a control substrate electrically interconnectingthe plurality of TAB packages and the signal generator and beingelectrically connected to a proximal end of said intermediate substrateat the plurality of TAB packages, said intermediate substrate having adistal end electrically connected to a proximal end of said at least oneprobe substrate, said at least one probe substrate having a distal endelectrically connectable to a substrate under inspection, said probeapparatus being characterized in that a plurality of probe substratesare disposed in a juxtaposed manner relative to each other and attachedto a single intermediate substrate.
 2. A probe apparatus as defined inclaim 1, wherein said inspecting device includes said control substrateelectrically connected to a signal generator, and said plurality of TAB(Tape Automated bonding) packages, said plurality of TAB packages eachhaving a proximal end electrically connected to said control substrateand a distal end electrically connected to the proximal end of saidintermediate substrate.
 3. A probe apparatus as defined in claim 1,wherein said inspecting device includes a control substrate electricallyconnected to a signal generator, a plurality of connecting substrates,and a plurality of TAB (Tape Automated bonding) packages, said pluralityof connecting substrates each having a proximal end electricallyconnected to said control substrate and a distal end electricallyconnected to a proximal end of one of said plurality of TAB packages,said plurality of TAB packages each having a distal end electricallyconnected to the proximal end of said intermediate substrate.
 4. A probeapparatus as defined in claim 1, wherein said intermediate substrateincludes a plurality of driving integrated circuit elements mountedthereon and each having a distal end connected to the proximal end ofone of said plurality of probe substrates.
 5. A probe apparatus asdefined in claim 4, wherein said inspecting device includes a controlsubstrate electrically connected to a signal generator, and a pluralityof connecting substrates, said plurality of connecting substrates eachhaving a proximal end electrically connected to said control substrate,and a distal end electrically connected to a proximal end of one of saidplurality of driving integrated circuit elements.
 6. A probe apparatusas defined in claim 3 or 5, wherein each of said connecting substratescomprises an FPC (Flexible Printed Circuit) and is bent for connection.7. A probe apparatus as defined in any one of claims 1 to 5, whereinsaid intermediate substrate is formed of an inorganic material.
 8. Aprobe apparatus as defined in claim 7, wherein said inorganic materialcomprises a ceramic material.
 9. A probe apparatus as defined in claim7, wherein said intermediate substrate has a coefficient of hygroscopicexpansion not exceeding 1 ppm/% RH.
 10. A probe apparatus as defined inany one of claims 1 to 5 wherein said intermediate substrate is at least2.5 times as thick as said probe substrate.
 11. A probe apparatus asdefined in any one of claims 1 to 5, wherein said probe substratecomprises an FPC (Flexible Printed Circuit).
 12. A probe apparatus asdefined in claim 11, wherein said probe substrate has a coefficient ofhygroscopic expansion not exceeding 10 ppm/% RH.
 13. A probe apparatusas defined in claim 1, wherein said probe substrate includes a pluralityof inspecting terminals arranged thereon, proximal ends of theseinspecting terminals being connected to distal ends of a plurality ofelectrodes arranged on said intermediate substrate, distal ends of saidinspecting terminals being connectable to a plurality of pads arrangedon said substrate under inspection.
 14. A probe apparatus as defined inclaim 13, wherein said inspecting terminals of said probe substrateshave a width smaller than a width of said pads and a space between saidpads of said substrate under inspection.
 15. A probe apparatus asdefined in claim 13, wherein the distal end of each of said inspectingterminals of said probe substrates is positioned inwardly of an edge atthe distal end of said probe substrate.
 16. A method of manufacturing aprobe apparatus having an inspecting device, an intermediate substrateand at least one probe substrate, the inspecting device including asignal generator, a plurality of TAB (Tape Automated Bonding) packagesand a control substrate electrically interconnecting the plurality ofTAB packages and the signal generator and being electrically connectedto a proximal end of the intermediate substrate at the plurality of TABpackages, the intermediate substrate having a distal end electricallyconnected to a proximal end of the at least one probe substrate, the atleast one probe substrate having a distal end electrically connectableto a substrate under inspection, the probe apparatus being characterizedin that a plurality of probe substrates are disposed in a juxtaposedmanner relative to each other and attached to a single intermediatesubstrate, the probe substrate includes a plurality of inspectingterminals arranged thereon, proximal ends of these inspecting terminalsbeing connected to distal ends of a plurality of electrodes arranged onthe intermediate substrate, distal ends of the inspecting terminalsbeing connectable to a plurality of pads arranged on the substrate underinspection, the method comprising the step of manufacturing the probeapparaus characterized in that said probe substrates, with intervals p3for forming the inspecting terminals at the distal ends of said probesubstrates to be connected to the pads of said substrate underinspection being larger than intervals for forming said pads, andintervals p4 for forming the inspecting terminals at the proximal endsof said probe substrates to be connected to said electrodes of theintermediate substrate being smaller than intervals for forming saidelectrodes of said intermediate substrate, are joined to saidintermediate substrate by thermo compression bonding, using one of ACF(Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF(Non-conductive Film) and NCP (Non-conductive Paste).
 17. A method ofinspecting a substrate by using a probe apparatus having an inspectingdevice, an intermediate substrate and at least one probe substrate, theinspecting device including a signal generator, a plurality of TAB (TapeAutomated Bonding) packages and a control substrate electricallyinterconnecting the plurality of TAB packages and the signal generatorand being electrically connected to a proximal end of the intermediatesubstrate at the plurality of TAB packages, the intermediate substratehaving a distal end electrically connected to a proximal end of the atleast one probe substrate, the at least one probe substrate having adistal end electrically connectable to a substrate under inspection, theprobe apparatus being characterized in that a plurality of probesubstrates are disclosed in a juxtaposed manner relative to each otherand attached to a single intermediate substrate, the method comprisingthe step of inspecting the substrate characterized in that a differencein coefficient of thermal expansion between said intermediate substrateand said substrate under inspection is 5 ppm/° C. or less.